Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17941020
|
Filing Dt:
|
09/09/2022
|
|
Publication #:
|
|
Pub Dt:
|
06/01/2023
| | | | |
|
Inventors:
|
Shouichirou NARUSE, Takeshi NAKANO, Toshiaki SHIMADA, Koichi OKUBO, Isao SAKAMOTO
|
|
Title:
|
SOLDER ALLOY, SOLDER BONDING MATERIAL, SOLDER PASTE, AND SEMICONDUCTOR PACKAGE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
|
|
|
|
| MORI & WARD, LLP |
| 2000 DUKE STREET |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
|
|
Search Results as of:
04/30/2024 12:51 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
