Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18072283
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Filing Dt:
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11/30/2022
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Publication #:
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Pub Dt:
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06/01/2023
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Inventor:
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Chun SHIAH
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Title:
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MEMORY MODULE WITH REDUCED BONDING WIRES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, TECHNOLOGY ROAD 5, |
| HSINCHU CITY, TAIWAN 30078 |
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| WPAT, PC INTELLECTUAL PROPERTY ATTORNEYS |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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