Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17922218
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Filing Dt:
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10/28/2022
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Publication #:
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Pub Dt:
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06/08/2023
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Inventors:
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Takashi Saito, Mai Susa, Hiroki Sudo
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Title:
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Lead-Free and Antimony-Free Solder Alloy, Solder Ball, Ball Grid Array, and Solder Joint
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, ADACHI-KU |
| TOKYO, JAPAN 120-8555 |
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| THE WEBB LAW FIRM |
| 420 FORT DUQUESNE BLVD., STE. 1200 |
| ONE GATEWAY CENTER |
| PITTSBURGH, PA 15222 |
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