Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18163498
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Filing Dt:
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02/02/2023
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Publication #:
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Pub Dt:
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06/15/2023
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Inventors:
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Hideki KOUNO, Kenji ISHII, Masato TOKUDA, Takahiro KITAHARA
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Title:
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FOAM MOLDING COMPOSITION, FOAM MOLDED BODY, ELECTRIC WIRE, METHOD FOR PRODUCING FOAM MOLDED BODY AND METHOD FOR PRODUCING ELECTRIC WIRE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| UMEDA CENTER BUILDING, |
| 4-12, NAKAZAKI-NISHI 2-CHOME, KITA-KU, |
| OSAKA-SHI, OSAKA, JAPAN 5308323 |
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| SUGHRUE MION, PLLC |
| 2000 PENNSYLVANIA AVENUE NW |
| SUITE 9000 |
| WASHINGTON, DC 20006 |
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