Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18054623
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Filing Dt:
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11/11/2022
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Publication #:
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Pub Dt:
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06/15/2023
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Inventors:
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Navid ASADI-ZANJANI, John TRUE, Chengjie XI
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Title:
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DIGITAL TWIN MODELING OF IC PACKAGING STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 223 GRINTER HALL |
| GAINESVILLE, FLORIDA 32611 |
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| AMY BOYD |
| 101 S. TRYON STREET |
| CHARLOTTE, NC 28280 |
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06/06/2024 06:04 PM
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