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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18108338
Filing Dt:
02/10/2023
Publication #:
Pub Dt:
06/15/2023
Inventors:
Shi YOU, He REN, Naomi YOSHIDA, Nikolaos BEKIARIS, Mehul NAIK, Martin Jay SEAMONS et al
Title:
METHOD OF DIELECTRIC MATERIAL FILL AND TREATMENT
Assignment: 1
Reel/Frame:
062683/0159Recorded: 02/14/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/15/2020
Exec Dt:
04/15/2020
Exec Dt:
04/15/2020
Exec Dt:
04/16/2020
Exec Dt:
04/16/2020
Exec Dt:
06/03/2020
Exec Dt:
05/25/2020
Exec Dt:
06/01/2020
Assignee:
3050 BOWERS AVENUE
SANTA CLARA, CALIFORNIA 95054
Correspondent:
MOSER TABOADA/ALAN TABOADA
1040 BROAD STREET
SUITE 103
SHREWSBURY, NJ 07702

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