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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
17827780
Filing Dt:
05/29/2022
Publication #:
20230192955
Pub Dt:
06/22/2023
Inventors:
Kosuke NAKADA, Hidekazu HIROSE, Kosaku YOSHIMURA, Shigeru SEITOKU, Hajime SUGAHARA et al
Title:
POLYIMIDE PRECURSOR SOLUTION, POROUS POLYIMIDE FILM, AND INSULATED WIRE
Assignment: 1
Reel/Frame:
060049/0067Recorded: 05/31/2022Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NAKADA, KOSUKE
Exec Dt:
04/19/2022
HIROSE, HIDEKAZU
Exec Dt:
04/12/2022
YOSHIMURA, KOSAKU
Exec Dt:
04/12/2022
SEITOKU, SHIGERU
Exec Dt:
04/12/2022
SUGAHARA, HAJIME
Exec Dt:
04/15/2022
YOSHIDA, SATOSHI
Exec Dt:
04/12/2022
Assignee:
FUJIFILM BUSINESS INNOVATION CORP.
7-3, AKASAKA 9-CHOME, MINATO-KU,
TOKYO, JAPAN
Correspondent:
JCIPRNET
8F-1, NO. 100, ROOSEVELT RD. SEC. 2,
TAIPEI, 100404 TAIWAN

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