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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18082572
Filing Dt:
12/15/2022
Publication #:
Pub Dt:
06/22/2023
Inventors:
Tae Dong PARK, Jin Hwan KIM, Chung Woo LEE, Chang Jun PARK
Title:
APPARATUS FOR WAFER PLACEMENT TEACHING AND METHOD FOR WAFER PLACEMENT TEACHING USING THE SAME
Assignment: 1
Reel/Frame:
062118/0561Recorded: 12/16/2022Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/28/2022
Exec Dt:
11/24/2022
Exec Dt:
11/23/2022
Exec Dt:
11/24/2022
Assignee:
77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU
CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31040
Correspondent:
PNJ IP LAW PC
18 ELM ST
WOOBURY, NY 11797

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