Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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17557529
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Filing Dt:
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12/21/2021
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Publication #:
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Pub Dt:
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06/22/2023
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Inventors:
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Kamal K. Sikka, Katsuyuki Sakuma, Hilton T. Toy, Shidong Li, Ravi K. Bonam
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Title:
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Electronic Package Structure With Offset Stacked Chips And Top And Bottom Side Cooling Lid
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| IBM CORPORATION - PATENTS+ TEAM |
| 2800 37TH STREET NW |
| ROCHESTER, MN 55901-4441 |
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05/14/2024 01:29 AM
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