Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18067655
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Filing Dt:
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12/16/2022
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Publication #:
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Pub Dt:
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06/22/2023
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Inventors:
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Rajesh Katkar, Hong Shen, Belgacem Haba, Patrick Variot
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Title:
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THERMOELECTRIC COOLING FOR DIE PACKAGES
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Assignment:
1
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SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
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| 101 NORTH TRYON STREET |
| CHARLOTTE, NORTH CAROLINA 28255 |
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| JEFFREY NEGRON |
| PAUL HASTINGS LLP |
| 200 PARK AVENUE |
| NEW YORK, NY 10166 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
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| KNOBBE, MARTENS, OLSON & BEAR LLP |
| 2040 MAIN STREET |
| 14TH FLOOR |
| IRVINE, CA 92614 |
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