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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18104856
Filing Dt:
02/02/2023
Publication #:
20230197572
Pub Dt:
06/22/2023
Inventors:
Weiwen ZHENG, Kanglin XIONG, Jiagui FENG, Xiaowei LI, Wenlong ZHANG, Kunliang BU et al
Title:
THROUGH-SILICON-VIA STRUCTURE AND METHOD FOR PREPARING SAME, THROUGH-SILICON-VIA INTERCONNECTION STRUCTURE AND METHOD FOR PREPARING SAME, AND ELECTRONIC DEVICE
Assignment: 1
Reel/Frame:
062626/0397Recorded: 02/02/2023Pages: 30
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ZHENG, WEIWEN
Exec Dt:
12/05/2022
XIONG, KANGLIN
Exec Dt:
12/05/2022
FENG, JIAGUI
Exec Dt:
12/05/2022
LI, XIAOWEI
Exec Dt:
12/05/2022
ZHANG, WENLONG
Exec Dt:
11/18/2022
BU, KUNLIANG
Exec Dt:
10/02/2022
LI, DENGFENG
Exec Dt:
02/01/2023
Assignee:
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
35/F, TENCENT BUILDING, KEJIZHONGYI ROAD
MIDWEST DISTRICT OF HI-TECH PARK, NANSHAN DISTRICT
SHENZHEN, CHINA 518057
Correspondent:
JUN CHENG
PO BOX 10395
CHICAGO, IL 60610
Assignment: 2
Reel/Frame:
063663/0762Recorded: 05/16/2023Pages: 31
Conveyance:
CORRECTIVE ASSIGNMENT ADD THE OMITTED SECOND ASSIGNEE PREVIOUSLY RECORDED ON REEL 062626 FRAME 0397. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
ZHENG, WEIWEN
Exec Dt:
12/05/2022
XIONG, KANGLIN
Exec Dt:
12/05/2022
FENG, JIAGUI
Exec Dt:
12/05/2022
LI, XIAOWEI
Exec Dt:
12/05/2022
ZHANG, WENLONG
Exec Dt:
11/18/2022
BU, KUNLIANG
Exec Dt:
10/02/2022
LI, DENGFENG
Exec Dt:
02/01/2023
Assignees:
TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
35/F, TENCENT BUILDING, KEJIZHONGYI ROAD
MIDWEST DISTRICT OF HI-TECH PARK, NANSHAN DISTRICT
SHENZHEN, CHINA 518057
GUSU LABORATORY OF MATERIALS
388 RUOSHUI ROAD
INDUSTRIAL PARK
SUZHOU, CHINA 215123
Correspondent:
JUN CHENG
PO BOX 10395
CHICAGO, IL 60610

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