Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17558457
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Filing Dt:
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12/21/2021
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Publication #:
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Pub Dt:
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06/22/2023
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Inventors:
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Jeremy Ecton, Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun et al
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Title:
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MICROELECTRONIC ASSEMBLIES INCLUDING INTERCONNECTS WITH DIFFERENT SOLDER MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BOULEVARD |
| SANTA CLARA, CALIFORNIA 95054 |
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| ALISHA FEUSTEL |
| PATENT CAPITAL GROUP |
| 30 FLOWER LANE |
| LEVITTOWN, PA 19055 |
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