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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18170078
Filing Dt:
02/16/2023
Publication #:
Pub Dt:
06/22/2023
Inventors:
Chia-Cheng CHANG, Tzu-Hung LIN, I-Hsuan PENG, Yi-Jou LIN
Title:
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANNULAR FRAME WITH TRUNCATED CORNERS
Assignment: 1
Reel/Frame:
062721/0063Recorded: 02/16/2023Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/12/2019
Exec Dt:
09/12/2019
Exec Dt:
09/12/2019
Exec Dt:
09/17/2019
Assignee:
NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK
HSINCHU CITY, TAIWAN 30078
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
SUITE 530, 280 INTERSTATE NORTH CIRCLE
ATLANTA, GA 30339

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