Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/02/2024
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Application #:
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17739202
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Filing Dt:
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05/09/2022
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Publication #:
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Pub Dt:
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06/22/2023
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Inventors:
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Zhengyu Shi, Linlin Wang, Rui Zhang
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Title:
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MEMS Chip
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| A-BLOCK, NANJING UNIVERSITY RESEARCH CENTER SHENZHEN BRANCH, NO. 6 YUEXING 3RD ROAD, SOUTH HI-TECH INDUSTRIAL PARK, NANSHAN DISTRICT, SHENZHEN, P. R. CHINA |
| SHENZHEN, CHINA |
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| MICHAEL WIERSCH |
| 2401 RIPPEY RD |
| LOOMIS, CA 95650 |
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05/11/2024 09:26 AM
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