Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17926930
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Filing Dt:
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11/21/2022
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Publication #:
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Pub Dt:
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06/29/2023
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Inventors:
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Daisuke HAMADA, Motokuni TAKENOUCHI, Tomoko OOKI, Tsuguki NISHIHARA, Masafumi HORIUCHI
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Title:
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MULTILAYER FILM, PACKAGING MATERIAL AND PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-1, TAITO 1-CHOME, TAITO-KU |
| TOKYO, JAPAN 110-0016 |
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| STAAS & HALSEY LLP |
| 1201 NEW YORK AVE., N.W. |
| SUITE 700 |
| WASHINGTON, DC 20005 |
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