Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17750369
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Filing Dt:
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05/22/2022
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Publication #:
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Pub Dt:
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06/29/2023
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Inventors:
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Do Youn LIM, Kuk Saeng KIM, Wan Hee JEONG
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Title:
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WAFER EXPANDER FOR UNIFORMLY EXPANDING GAP BETWEEN DIES, AND DIE SUPPLYING MODULE AND DIE BONDING EQUIPMENT INCLUDING SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 77, 4SANDAN 5-GIL, JIKSAN-EUP, SEOBUK-GU |
| CHEONAN-SI, CHUNGCHEONGNAM-DO, KOREA, REPUBLIC OF 31040 |
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| PNJ IP LAW PC |
| 18 ELM ST |
| WOOBURY, NY 11797 |
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