Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17562211
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Filing Dt:
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12/27/2021
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Publication #:
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Pub Dt:
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06/29/2023
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Inventors:
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Hiroyuki FUJISHIMA, Shang-Yu CHANG-CHIEN
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Title:
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CHIP-MIDDLE TYPE FAN-OUT PANEL-LEVEL PACKAGE AND PACKAGING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.10, DATONG RD. |
| HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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| JAMES WALTERS; PATENTTM.US |
| P.O. BOX 82788 |
| PORTLAND, OR 97282-0788 |
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