Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18066510
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Filing Dt:
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12/15/2022
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Publication #:
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Pub Dt:
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07/06/2023
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Inventors:
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In Kwon Kim, Sang Kyun Kim, Hyo San Lee, Yea Rin Byun, Bo Yun Kim, Bo Un Yoon et al
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Title:
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POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECHANICAL POLISHING APPARATUS INLUDING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE CHEMICAL MECHANICAL POLISHING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 129, SAMSUNG-RO, YEONGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677 |
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| MYERS BIGEL,P.A. |
| PO BOX 37428 |
| RALEIGH, NC 27627 |
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