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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
18147733
Filing Dt:
12/29/2022
Publication #:
Pub Dt:
07/06/2023
Inventors:
EUNHYEA KO, Soyoung Lee, Tomoharu Yoshino, Hoon Han, Thanh Cuong Nguyen, Daekeon Kim et al
Title:
METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING CARBONYL COMPOUNDS
Assignment: 1
Reel/Frame:
062236/0421Recorded: 12/29/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/05/2022
Exec Dt:
07/05/2022
Exec Dt:
07/05/2022
Assignee:
2-35, HIGASHIOGU 7-CHOME, ARAKAWA-KU
TOKYO, JAPAN
Correspondent:
CANA CREECH
4140 PARKLAKE AVENUE
6TH FLOOR, SUITE 600
RALEIGH, NC 27612
Assignment: 2
Reel/Frame:
062236/0313Recorded: 12/29/2022Pages: 11
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/06/2022
Exec Dt:
07/06/2022
Exec Dt:
07/06/2022
Exec Dt:
07/06/2022
Exec Dt:
07/06/2022
Exec Dt:
07/21/2022
Exec Dt:
09/27/2022
Exec Dt:
07/21/2022
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
CANA CREECH
4140 PARKLAKE AVENUE
6TH FLOOR, SUITE 600
RALEIGH, NC 27612

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