Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18119119
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Filing Dt:
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03/08/2023
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Publication #:
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Pub Dt:
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07/13/2023
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Inventors:
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Koichiro YAMAMOTO, Takuya ISHIHARA, Hidenori HASHIMOTO
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Title:
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RESIN COMPOSITION FOR SEALANT, MULTILAYERED BODY, PACKAGING MATERIAL AND PACKAGING CONTAINER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-2, HIGASHI-SHIMBASHI 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-7122 |
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| RANKIN, HILL & CLARK LLP |
| 23755 LORAIN ROAD, SUITE 200 |
| NORTH OLMSTED, OH 44070 |
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