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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18184036
Filing Dt:
03/15/2023
Publication #:
Pub Dt:
07/13/2023
Inventors:
You Che CHUANG, Chih-Ming LEE, Hsin-Chi CHEN, Hsun-Ying HUANG
Title:
SEMICONDUCTOR DEVICE HAVING A BUTTED CONTACT AND METHOD OF FORMING
Assignment: 1
Reel/Frame:
062985/0883Recorded: 03/15/2023Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/25/2019
Exec Dt:
06/25/2019
Exec Dt:
04/25/2019
Exec Dt:
04/25/2019
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAUPTMAN HAM, LLP
2318 MILL ROAD, SUITE 1400
ALEXANDRIA, VA 22314

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