Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/31/2023
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Application #:
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18192542
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Filing Dt:
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03/29/2023
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Publication #:
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Pub Dt:
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07/20/2023
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Inventors:
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David Abraham, John Michael Cotte, Shawn Anthony Hall
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Title:
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COMBINED BACKING PLATE AND HOUSING FOR USE IN BUMP BONDED CHIP ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| AMIN, TUROCY & WATSON, LLP - IBM |
| 200 PARK AVENUE |
| SUITE 300 |
| BEACHWOOD, OH 44122 |
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