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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18098578
Filing Dt:
01/18/2023
Publication #:
Pub Dt:
07/20/2023
Inventors:
Sang Hyuck NAM, Myung Jae KWON, Jin Hyoung PARK
Title:
SEMICONDUCTOR PACKAGE
Assignment: 1
Reel/Frame:
062429/0456Recorded: 01/19/2023Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/13/2023
Exec Dt:
01/11/2023
Exec Dt:
01/11/2023
Assignee:
30, MAGOKJUNGANG 10-RO, GANGSEO-GU
SEOUL, KOREA, REPUBLIC OF 07796
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
8110 GATEHOUSE ROAD, SUITE 100E
FALLS CHURCH, VA 22042

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