Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18126893
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Filing Dt:
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03/27/2023
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Publication #:
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Pub Dt:
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07/27/2023
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Inventors:
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Timothy L. Olson, Clifford Sandstrom, Craig Bishop, Robin Davis
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Title:
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STACKABLE FULLY MOLDED SEMICONDUCTOR STRUCTURE WITH THROUGH SILICON VIA (TSV) VERTICAL INTERCONNECTS AND METHOD OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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7855 SOUTH RIVER PARKWAY, STE. 205 |
TEMPE, ARIZONA 85284 |
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CHANTAL OWENS |
1255 W. RIO SALADO PKWY., STE. 215 |
TEMPE, AZ 85281 |
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06/14/2024 02:37 AM
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