Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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01/02/2024
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Application #:
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18128622
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Filing Dt:
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03/30/2023
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Publication #:
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Pub Dt:
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07/27/2023
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Inventors:
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Chee Keong Loh, Foo You Chow, Ridzuan Hanapi, Boon Soo Lim
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Title:
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SEMICONDUCTOR WAFER THINNED BY STEALTH LASING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5601 GREAT OAKS PARKWAY |
| SAN JOSE, CALIFORNIA 95119 |
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| VIERRA MAGEN MARCUS LLP |
| 2001 JUNIPERO SERRA BLVD., STE. 515 |
| DALY CITY, 94014 UNITED STATES |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME PREVIOUSLY RECORDED AT REEL: 063172 FRAME: 0688. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT .
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| 5601 GREAT OAKS PARKWAY |
| SAN JOSE, CALIFORNIA 95119 |
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| VIERRA MAGEN MARCUS LLP |
| 2001 JUNIPERO SERRA BLVD., STE. 515 |
| DALY CITY, CA 94014 |
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Assignment:
3
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PATENT COLLATERAL AGREEMENT - A&R LOAN AGREEMENT
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| 10 S. DEARBORN L2 |
| CHICAGO, ILLINOIS 60603 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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Assignment:
4
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PATENT COLLATERAL AGREEMENT - DDTL LOAN AGREEMENT
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| 10 S. DEARBORN L2 |
| CHICAGO, ILLINOIS 60603 |
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| CT CORPORATION |
| 4400 EASTON COMMONS WAY |
| SUITE 125 |
| COLUMBUS, OH 43219 |
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05/08/2024 07:48 PM
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