Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18079375
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Filing Dt:
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12/12/2022
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Publication #:
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Pub Dt:
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07/27/2023
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Inventors:
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Ryota Watanabe, Masahiro Kitamura, Mizuki Itoyama, Takuroh Kamimura, Junrong Zhou
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Title:
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HEAT DISSIPATION STRUCTURE, METHOD FOR MANUFACTURING HEAT DISSIPATION STRUCTURE, AND ELECTRONIC APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 151 LORONG CHUAN |
| #02-01 NEW TECH PARK |
| SINGAPORE, SINGAPORE 556741 |
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| THOMAS K. SCHERER |
| 1100 LOUISIANA STREET, SUITE 4900 |
| HOUSTON, TX 77002 |
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