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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18136500
Filing Dt:
04/19/2023
Publication #:
Pub Dt:
08/10/2023
Inventors:
Yun-Wei CHENG, Chun-Hao Chou, Kuo-Cheng Lee, Ying-Hao Chen
Title:
Heat Dissipation Structures
Assignment: 1
Reel/Frame:
063378/0023Recorded: 04/19/2023Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/26/2020
Exec Dt:
02/26/2020
Exec Dt:
02/27/2020
Exec Dt:
03/04/2020
Assignee:
NO. 8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
STERNE, KESSLER, GOLDSTEIN & FOX P.L.L.C
1100 NEW YORK AVE., N.W.
WASHINGTON, DC 20005

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