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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
17665191
Filing Dt:
02/04/2022
Publication #:
Pub Dt:
08/10/2023
Inventors:
Alexander Komposch, Arthur Fong-Yuen Pun, Scott T. Sheppard, Kevin Shawne Schneider
Title:
SEMICONDUCTOR DIE INCLUDING A METAL STACK
Assignment: 1
Reel/Frame:
059276/0530Recorded: 03/16/2022Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/03/2022
Exec Dt:
02/07/2022
Exec Dt:
03/15/2022
Exec Dt:
02/21/2022
Assignee:
4600 SILICON DRIVE
DURHAM, NORTH CAROLINA 27703
Correspondent:
LYNNE A. BORCHERS
P.O. BOX 30789
SAGE PATENT GROUP
RALEIGH, NC 27622-0789
Assignment: 2
Reel/Frame:
064185/0755Recorded: 06/30/2023Pages: 69
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/23/2023
Assignee:
214 N. TRYON STREET, 27TH FLOOR
MAIL CODE CN-NC-H27A
CHARLOTTE, NORTH CAROLINA 28202
Correspondent:
NIKOLAI DOKKEDAHL
1285 AVENUE OF THE AMERICAS
PAUL WEISS RIFKIND WHARTON &GARRISON LLP
NEW YORK, NY 10019-6064

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