Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18301793
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Filing Dt:
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04/17/2023
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Publication #:
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Pub Dt:
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08/10/2023
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Inventors:
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Toshiharu MARUI, Tetsuya HAYASHI, Keiichiro NUMAKURA, Wei NI, Ryota TANAKA
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Title:
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SEMICONDUCTOR DEVICE, POWER MODULE AND MANUFACTURING METHOD FOR THE SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2, TAKARA-CHO, KANAGAWA-KU |
YOKOHAMA-SHI, KANAGAWA, JAPAN |
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13-15 QUAI LE GALLO |
BOULOGNE-BILLANCOURT, FRANCE F-92100 |
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FOLEY & LARDNER LLP |
3000 K STREET, N.W. |
SUITE 600 |
WASHINGTON, DC 20007 |
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05/13/2024 06:09 AM
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