Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18157159
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Filing Dt:
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01/20/2023
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Publication #:
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Pub Dt:
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08/17/2023
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Inventors:
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Yin-Fa CHEN, Bo-Jiun YANG, Ta-Jen YU, Bo-Hao MA, Chih-Wei CHANG, Tsung-Yu PAN, Tai-Yu CHEN et al
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Title:
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SEMICONDUCTOR PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING 1ST RD., HSINCHU SCIENCE PARK |
| HSINCHU CITY, TAIWAN 30078 |
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| MCCLURE, QUALEY & RODACK LLP |
| 280 INTERSTATE NORTH CIRCLE |
| SUITE 550 |
| ATLANTA, GA 30339 |
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