Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18020349
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Filing Dt:
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02/08/2023
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Publication #:
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Pub Dt:
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08/24/2023
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Inventor:
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Weiyuan YANG
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Title:
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DIE AND MANUFACTURING METHOD THEREFOR, AND CHIP PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| BUILDING C, NO. 25 XIYONG ROAD, SHAPINGBA DISTRICT |
| CHONGQING, CHINA 401331 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 125 S. ROYAL ST. |
| ALEXANDRIA, VA 22314 |
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