Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/05/2023
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Application #:
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18172781
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Filing Dt:
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02/22/2023
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Publication #:
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Pub Dt:
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08/24/2023
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Inventors:
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Malcom Parker Brown, Will Findlay, Casey Anderson, Jean-Paul Ortiz, Mark Terlaak et al
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Title:
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FLEXIBLE INTERCONNECT CIRCUITS AND METHODS OF FABRICATION THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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610 QUARRY RD. |
SAN CARLOS, CALIFORNIA 94070 |
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POLYGON IP, LLP |
101 JEFFERSON DRIVE |
MENLO PARK, CA 94025 |
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Assignment:
2
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NOTICE OF SECURITY INTEREST IN INTELLECTUAL PROPERTY
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388 GREENWICH STREET |
NEW YORK, NEW YORK 10013 |
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JUSTINE LU/WHITE & CASE LLP |
555 SOUTH FLOWER STREET, SUITE 2700 |
LOS ANGELES, CA 90071 |
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