Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18144580
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Filing Dt:
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05/08/2023
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Publication #:
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Pub Dt:
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08/31/2023
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Inventors:
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Qiuzhi LIU, Fei YU, Chaojun RAO, Song YANG
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Title:
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HEAT DISSIPATION ASSEMBLY, ELECTRONIC DEVICE, AND CHIP PACKAGE STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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HUAWEI ADMINISTRATION BUILDING |
BANTIAN, LONGGANG DISTRICT |
SHENZHEN, GUANGDONG, CHINA 518129 |
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WOMBLE BOND DICKINSON (US) LLP |
P.O BOX 7037 |
ATLANTA, GA 30357 |
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05/13/2024 04:00 AM
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