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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18311130
Filing Dt:
05/02/2023
Publication #:
20230276567
Pub Dt:
08/31/2023
Inventors:
Tarou HIGUCHI, Yoshihiro IMANISHI, Yasushi SAITO, Akio IGARASHI, Minehito YOSHIDA et al
Title:
MULTILAYER CIRCUIT BOARD HAVING SIGNAL AND POWER ISOLATION CIRCUIT
Assignment: 1
Reel/Frame:
063512/0690Recorded: 05/02/2023Pages: 18
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HIGUCHI, TAROU
Exec Dt:
04/26/2023
IMANISHI, YOSHIHIRO
Exec Dt:
04/17/2023
SAITO, YASUSHI
Exec Dt:
04/17/2023
IGARASHI, AKIO
Exec Dt:
04/18/2023
YOSHIDA, MINEHITO
Exec Dt:
04/24/2023
HONDA, HIROYUKI
Exec Dt:
04/17/2023
INUI, MASAKI
Exec Dt:
04/17/2023
NAGAOKA, YUYA
Exec Dt:
04/18/2023
Assignee:
MURATA MANUFACTURING CO., LTD.
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI
KYOTO-FU, JAPAN 617-8555
Correspondent:
STUDEBAKER & BRACKETT PC
8255 GREENSBORO DRIVE
SUITE 300
TYSONS, VA 22102

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