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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18040765
Filing Dt:
02/06/2023
Publication #:
Pub Dt:
09/07/2023
Inventors:
Kyungwoo KIM, Yukitoshi TERASAKA, Hironobu YAMAMOTO, Toshinari KOBAYASHI
Title:
COMPOSITE MOLDED COMPONENT
Assignment: 1
Reel/Frame:
063095/0461Recorded: 03/24/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/26/2022
Exec Dt:
03/23/2023
Exec Dt:
12/22/2022
Exec Dt:
12/22/2022
Assignee:
1-14, NISHISUEHIRO-CHO
YOKKAICHI-SHI, MIE, JAPAN 5108503
Correspondent:
HONIGMAN LLP
650 TRADE CENTRE WAY
SUITE 200
KALAMAZOO, MI 49002-0402

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