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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18098856
Filing Dt:
01/19/2023
Publication #:
Pub Dt:
09/07/2023
Inventors:
Eun Hyea KO, Byung Keun HWANG, Jeong Ho MUN, Hyun-Ji SONG, Hoon HAN, Jae Woon KIM et al
Title:
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
062435/0441Recorded: 01/19/2023Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/20/2022
Exec Dt:
10/20/2022
Exec Dt:
10/20/2022
Exec Dt:
10/20/2022
Exec Dt:
10/20/2022
Exec Dt:
10/20/2022
Exec Dt:
10/20/2022
Exec Dt:
10/25/2022
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
EUGENE M LEE
LEE IP LAW, P.C.
3141 FAIRVIEW PARK DRIVE, SUITE 500
FALLS CHURCH, VA 22042

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