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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18111427
Filing Dt:
02/17/2023
Publication #:
Pub Dt:
09/07/2023
Inventors:
Kambiz Vafai, Sainan Lu
Title:
THREE-DIMENSIONAL INTEGRATED CIRCUIT
Assignment: 1
Reel/Frame:
063659/0657Recorded: 05/16/2023Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/17/2023
Exec Dt:
03/17/2023
Assignee:
PO BOX 4484
ALBUQUERQUE, NEW MEXICO 87196-4484
Correspondent:
ORTIZ & LOPEZ, PLLC
PO BOX 4484
ALBUQUERQUE, NM 87196-4484

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