Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17683377
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Filing Dt:
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03/01/2022
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Publication #:
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Pub Dt:
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09/07/2023
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Inventors:
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Cheng-Hsien Hsieh, Wei-Cheng Wu, Wei-Chih Lai, Li-Han Hsu, Der-Chyang Yeh
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Title:
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INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 300-78 |
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| JCIPRNET |
| 8F-1, NO. 100, ROOSEVELT RD. SEC. 2, |
| TAIPEI, 100404 TAIWAN |
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