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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
NONE
Issue Dt:
Application #:
18019447
Filing Dt:
02/02/2023
Publication #:
20230286799
Pub Dt:
09/14/2023
Inventors:
Yonggang ZHU, Chaozhan CHEN, Huaying CHEN, Bin RAN, Bo LIU, Chuanwen LV
Title:
MANUFACTURING METHOD FOR 3D MICROELECTRODE
Assignment: 1
Reel/Frame:
062577/0052Recorded: 02/02/2023Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ZHU, YONGGANG
Exec Dt:
01/04/2023
CHEN, CHAOZHAN
Exec Dt:
01/04/2023
CHEN, HUAYING
Exec Dt:
01/04/2023
RAN, BIN
Exec Dt:
01/04/2023
LIU, BO
Exec Dt:
01/04/2023
LV, CHUANWEN
Exec Dt:
01/04/2023
Assignee:
HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN [
HIT CAMPUS OF UNIVERSITY TOWN OF SHENZHEN
XILI
NANSHAN DISTRICT SHENZHEN, GUANGDONG, CHINA 518055
Correspondent:
SHUMAKER LOOP & KENDRICK, LLP
101 SOUTH TRYON STREET
SUITE 2200
CHARLOTTE, NC 28280-0002
Assignment: 2
Reel/Frame:
064163/0569Recorded: 06/29/2023Pages: 19
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE SPELLING OF THE ASSIGNEE'S NAME TO HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN PREVIOUSLY RECORDED ON REEL 062577 FRAME 0052. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
ZHU, YONGGANG
Exec Dt:
01/04/2023
CHEN, CHAOZHAN
Exec Dt:
01/04/2023
CHEN, HUAYING
Exec Dt:
01/04/2023
RAN, BIN
Exec Dt:
01/04/2023
LIU, BO
Exec Dt:
01/04/2023
LV, CHUANWEN
Exec Dt:
01/04/2023
Assignee:
HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN
HIT CAMPUS OF UNIVERSITY TOWN OF SHENZHEN
XILI
NANSHAN DISTRICT SHENZHEN, GUANGDONG, CHINA 518005
Correspondent:
SHUMAKER, LOOP & KENDRICK, LLP
101 SOUTH TRYON STREET
SUITE 2200
CHARLOTTE, NC 28280-0002
Assignment: 3
Reel/Frame:
065018/0459Recorded: 09/22/2023Pages: 17
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE POSTAL CODE OF THE ASSIGNEE'S ADDRESS TO 518055 PREVIOUSLY RECORDED ON REEL 064163 FRAME 0569. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
ZHU, YONGGANG
Exec Dt:
01/04/2023
CHEN, CHAOZHAN
Exec Dt:
01/04/2023
CHEN, HUAYING
Exec Dt:
01/04/2023
RAN, BIN
Exec Dt:
01/04/2023
LIU, BO
Exec Dt:
01/04/2023
LV, CHUANWEN
Exec Dt:
01/04/2023
Assignee:
HARBIN INSTITUTE OF TECHNOLOGY, SHENZHEN
HIT CAMPUS OF UNIVERSITY TOWN OF SHENZHEN
XILI
NANSHAN DISTRICT SHENZHEN, GUANGDONG, CHINA 518055
Correspondent:
SHUMAKER, LOOP & KENDRICK, LLP
101 SOUTH TRYON STREET
SUITE 2200
CHARLOTTE, NC 28280-0002

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