Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18318887
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Filing Dt:
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05/17/2023
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Publication #:
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Pub Dt:
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09/14/2023
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Inventors:
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Sin-Yao Huang, Jeng-Shyan Lin, Shih-Pei Chou, Tzu-Hsuan Hsu
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Title:
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ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, LI-HSIN RD. 6 |
| HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| ESCHWEILER & POTASHNIK, LLC |
| 3500 MASSILLON ROAD |
| SUITE 420 |
| UNIONTOWN, OH 44685 |
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05/14/2024 06:37 AM
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