Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17752849
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Filing Dt:
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05/24/2022
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Publication #:
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Pub Dt:
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09/14/2023
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Inventors:
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Xinnan Sun, Bodong Li, Min Chen, Xiaoqing Wang, Dongbo Zhang
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Title:
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PACKAGE STRUCTURE OF EMBEDDED POWER MODULE WITH LOW PARASITIC INDUCTANCE AND HIGH HEAT DISSIPATION EFFICIENCY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 866 YUHANGTANG ROAD, XIHU DISTRICT |
| HANGZHOU, ZHEJIANG, CHINA 310058 |
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| BYIP LTD. |
| 5465 LEGACY DRIVE, SUITE 650 |
| PLANO, TX 75024 |
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