Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18015712
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Filing Dt:
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01/11/2023
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Publication #:
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Pub Dt:
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09/14/2023
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Inventors:
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Hong Bean PARK, Yong Hee PARK, Hong Ju JUNG
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Title:
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COMPONENT GROUNDING SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 119, MAPO-DAERO, MAPO-GU, |
| SEOUL, UNITED STATES 04144 |
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| HARVEST IP LAW LLP |
| 4208 EVERGREEN LANE, SUITE 232 |
| ANNANDALE, 22003 UNITED STATES |
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