Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/02/2024
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Application #:
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18034972
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Filing Dt:
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05/02/2023
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Publication #:
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Pub Dt:
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09/28/2023
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Inventors:
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Hiroshi SUGII, Yasuhiro KAJIKAWA, Yo YAMADA
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Title:
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FLUX AND SOLDER PASTE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23, SENJU-HASHIDO-CHO, |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| BRIAN S. MYERS |
| 100 S. JEFFERSON ROAD |
| SUITE 202 |
| WHIPPANY, NJ 07981 |
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