Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18203631
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Filing Dt:
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05/30/2023
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Publication #:
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Pub Dt:
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09/28/2023
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Inventors:
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Ta-Jen Yu, Wen-Chin Tsai, Isabella Song, Tai-Yu Chen, Che-Hung Kuo, Hsing-Chih Liu et al
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Title:
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PACKAGE-ON-PACKAGE HAVING A THICK LOGIC DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| WINSTON HSU |
| 5F., NO.389, FUHE RD., YONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN |
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