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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18205886
Filing Dt:
06/05/2023
Publication #:
Pub Dt:
09/28/2023
Inventors:
Kazuhisa TORIGOE, Toshiaki ONO, Shunya KAWAGUCHI
Title:
SILICON WAFER AND MANUFACTURING METHOD OF THE SAME
Assignment: 1
Reel/Frame:
063856/0630Recorded: 06/05/2023Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/01/2021
Exec Dt:
04/01/2021
Exec Dt:
04/01/2021
Assignee:
2-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN 105-8634
Correspondent:
GREENBLUM & BERNSTEIN, PLC
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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