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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
04/30/2024
Application #:
18000512
Filing Dt:
12/02/2022
Publication #:
20230308759
Pub Dt:
09/28/2023
Inventors:
Hiroshi ARAI, Yuriko OHTSUKA, Kenichiro NISHI, Takeshi MASUURA, Norimitsu OKIYAMA et al
Title:
SIGNAL PROCESSING DEVICE AND SIGNAL PROCESSING METHOD
Assignment: 1
Reel/Frame:
061953/0359Recorded: 12/02/2022Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
NISHI, KENICHIRO
Exec Dt:
10/19/2022
MASUURA, TAKESHI
Exec Dt:
10/31/2022
TAKASHIMA, SATOSHI
Exec Dt:
10/20/2022
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHICHO, ATSUGI-SHI
KANAGAWA, JAPAN 2430014
Correspondent:
XSENSUS LLP
100 DAINGERFIELD ROAD
SUITE 402
ALEXANDRIA, VA 22314
Assignment: 2
Reel/Frame:
063303/0426Recorded: 04/12/2023Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ARAI, HIROSHI
Exec Dt:
10/19/2022
OHTSUKA, YURIKO
Exec Dt:
10/19/2022
OKIYAMA, NORIMITSU
Exec Dt:
10/19/2022
MATSUI, YUJI
Exec Dt:
10/19/2022
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1, ASAHICHO
ATSUGI-SHI, KANAGAWA, JAPAN
Correspondent:
XSENSUS LLP
100 DAINGERFIELD ROAD
SUITE 402
ALEXANDRIA, VA 22314

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