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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
18194908
Filing Dt:
04/03/2023
Publication #:
Pub Dt:
10/05/2023
Inventors:
Kyuyoung Hwang, Byungjoon Kang, Daihyun Kim, Sungmin Kim, Jungmin Oh, Mihyun Park et al
Title:
ETCHING COMPOSITION, METHOD OF ETCHING METAL-CONTAINING FILM BY USING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
Assignment: 1
Reel/Frame:
067182/0149Recorded: 04/22/2024Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Exec Dt:
01/03/2024
Assignee:
129, SAMSUNG-RO, YEONGTONG-GU
SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 16677
Correspondent:
ALEX ZHOU
P.O. BOX 8910
RESTON, VA 20195

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