Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18017001
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Filing Dt:
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01/19/2023
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Publication #:
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Pub Dt:
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10/05/2023
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Inventors:
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Yang TANG, Yue WU, Baode SUN, Yongbing DAI, Qing DONG, Jiao ZHANG, Ya ZHANG, Hui XING et al
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Title:
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MULTI-PHYSICAL FIELD MEASUREMENT DEVICE FOR METAL SOLIDIFICATION PROCESS AND HOUSING THEREOF, AND MEASUREMENT METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 800 DONGCHUAN ROAD |
| MINHANG DISTRICT |
| SHANGHAI, CHINA 200240 |
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| HOGAN LOVELLS US LLP |
| 4 EMBARCADERO CENTER, SUITE 3500 |
| SAN FRANCISCO, CA 94111 |
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