Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
17854489
|
Filing Dt:
|
06/30/2022
|
|
Publication #:
|
|
Pub Dt:
|
10/05/2023
| | | | |
|
Inventors:
|
Ho-Ming TONG, Wei YEN, Chao-Chun LU
|
|
Title:
|
COMPOSITE SEMICONDUCTOR WAFER/CHIP FOR ADVANCED ICS AND ADVANCED IC PACKAGES AND THE MANUFACTURE METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2F., NO. 22, LN. 35, JIHU RD., NEIHU DIST. |
| TAIPEI CITY, TAIWAN 114754 |
|
|
|
| NO. 6, TECHNOLOGY ROAD 5 |
| HSINCHU, TAIWAN 300 |
|
|
|
|
| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22042 |
|
|
Search Results as of:
05/09/2024 02:59 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
