Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17657760
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Filing Dt:
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04/04/2022
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Publication #:
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Pub Dt:
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10/05/2023
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Inventors:
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Stanley Seungchul Song, Je-Hsiung Lan, Jonghae Kim, Periannan Chidambaram
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Title:
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THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT (IC) (3DIC) PACKAGE EMPLOYING A REDISTRIBUTION LAYER (RDL) INTERPOSER FACILITATING SEMICONDUCTOR DIE STACKING, AND RELATED FABRICATION METHODS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5775 MOREHOUSE DRIVE |
| SAN DIEGO, CALIFORNIA 92121-1714 |
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| W&T/QUALCOMM |
| 106 PINEDALE SPRINGS WAY |
| CARY, NC 27511 |
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